Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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- Taschenbuch
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Form:Einzelkauf Download
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Sprache:Englisch
Fr. 196.90
inkl. gesetzl. MwSt.Beschreibung
Produktdetails
Format
ePUB 3
Kopierschutz
Nein
Family Sharing
Nein
Text-to-Speech
Ja
Erscheinungsdatum
14.11.2019
Verlag
Elsevier Science & Techn.Seitenzahl
434 (Printausgabe)
Sprache
Englisch
EAN
9780081025338
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
- Provides multiphysics modeling and analysis techniques of electronic packaging
- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
- Provides multiphysics modeling and analysis techniques of electronic packaging
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