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Lead-Free Soldering in Electronics Science, Technology, and Environmental Impact

Science, Technology, and Environmental Impact

Suganuma Suganuma, K. Suganuma

Buch (gebundene Ausgabe, Englisch)
Buch (gebundene Ausgabe, Englisch)
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Fr. 277.00
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inkl. gesetzl. MwSt.
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  • Lead-Free Soldering in Electronics Science, Technology, and Environmental Impact

    Marcel Dekker Inc

    Versandfertig innert 4 - 7 Werktagen

    Fr. 277.00

    Marcel Dekker Inc

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Beschreibung

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and designMechanical evaluation in electronics Lead-free solder paste and reflow solderingWave solderingPlating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Suganuma\, Katsuaki

Produktdetails

Einband gebundene Ausgabe
Herausgeber Katsuaki Suganuma
Seitenzahl 376
Erscheinungsdatum Juli 2004
Sprache Englisch
ISBN 978-0-8247-4102-0
Verlag Marcel Dekker Inc
Maße (L/B/H) 23.6/16.1/2.2 cm
Gewicht 635 g
Abbildungen farbige, schwarzweisse Abbildungen

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  • Introduction to Lead-Free Soldering Technology, K. SuganumaMaterials Science Concepts in Lead-Free Soldering, C. Handwerker, U. Kattner, and K. MoonAlloy Selections, K. NimmoPlating Lead-Free Soldering in Electronics, H. NawafuneTin Whisker Discovery and Research, Y. ZhangMechanical Evaluation in Electronics, W.J. PlumbridgeElectrochemical Migration, H. TanakaLead-Free Solder Paste and Reflow Soldering, S. FujiuchiWave Soldering, T. NishimuraSoldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection, M. HiranoFuture of Lead-Free Soldering, K. SuganumaIndex