Shakya Shilak: Stress Analysis of Bonded Assemblies: Applica Axisymmetric Assemblies under Thermal Loading
-
- Englisch ausgewählt
Fr. 110.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
01.09.2008
Verlag
VDMSeitenzahl
256
Maße (L/B/H)
22/15/1.5 cm
Gewicht
344 g
Sprache
Englisch
ISBN
978-3-639-06032-4
the maximum shearing displacement in a bonded
assembly under global thermal mismatch loading.
Analytical model includes: i) elastic analysis, ii)
elasto-plastic analysis, iii) viscoelastic analysis,
and iv) viscoelastic-plastic analysis.
All results have been derived as closed-form
correction factors to be applied to the easily
calculated unconstrained shear displacement to obtain
the maximum shear displacement. The motivation for
determining the maximum shear displacement is to
compute the maximum shear strain, which is then used
to estimate the cycles-to-failure by means of a
fatigue law. The analytical relations derived are simple,
easy-to-use, and helpful for studying the interaction
among the various design parameters. The analytical
relations are in good agreement with existing
experimental and numerical results.
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