Produktbild: Shwartz, G: Handbook of Semiconductor Interconnection Techno

Shwartz, G: Handbook of Semiconductor Interconnection Techno

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

22.02.2006

Abbildungen

schwarz-weiss Illustrationen, Raster, schwarz-weiss, Tabellen, schwarz-weiss

Herausgeber

Geraldine C. Schwartz + weitere

Verlag

Taylor and Francis

Seitenzahl

536

Maße (L/B/H)

25.4/17.8/3 cm

Gewicht

1112 g

Sprache

Englisch

ISBN

978-1-57444-674-6

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

22.02.2006

Abbildungen

schwarz-weiss Illustrationen, Raster, schwarz-weiss, Tabellen, schwarz-weiss

Herausgeber

Verlag

Taylor and Francis

Seitenzahl

536

Maße (L/B/H)

25.4/17.8/3 cm

Gewicht

1112 g

Sprache

Englisch

ISBN

978-1-57444-674-6

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  • Produktbild: Shwartz, G: Handbook of Semiconductor Interconnection Techno
  • METHODS/PRINCIPLES OF DEPOSITION AND ETCHING OF THIN FILMS; Geraldine Cogin SchwartzIntroductionEvaporationChemical Vapor DepositionPhotoenhanced CVDPlasma ProcessingElectrochemical DepositionSpin CoatingConclusionReferencesCHARACTERIZATION; Geraldine Cogin SchwartzIntroductionOptical Characterization of Dielectric FilmsInfrared (IR) SpectroscopyResistivity of Metal FilmsThicknessDielectric Constant of DielectricsBreakdown StrengthAdhesionMechanical PropertiesThermal PropertiesAuger Electron Spectroscopy (AES)X-Ray Photoelectron Spectroscopy (XPS): Also Called Electron Spectroscopy for Chemical Analysis (ESCA)Secondary Ion Mass Spectroscopy (SIMS)Electron MicroprobeX-Ray Fluorescence Spectrometry (XRFS)Hydrogen AnalysisRutherford Backscattering Spectrometry (RBS)Specular X-Ray Reflectivity (SXR)Small-Angle Neutron Scattering (SANS)Positronium Annihilation Lifetime Spectroscopy (PALS)Ellipsometric Porosimetry (EP)Scanning Electron Microscope (SEM)Transmission Electron Microscope (TEM)Focused Ion Beam (FIB)Atomic Force Microscope (AFM)Thermal Wave-Modulated Optical Reflectance Imaging (TW)X-Ray Diffraction (XRD)Wet Chemical MethodsChromatographyOther Analytical TechniquesThermometryElectrochemical MethodsPlasma DiagnosticsReferencesSEMICONDUCTOR CONTACT TECHNOLOGY; David R. Campbell, Revised by Catherine IversIntroductionImportance of Contact TechnologyElectrical Aspects of Silicon ContactsMaterial AspectsOhmic ContactsActive Device ContactsContact Studs for ULSIConclusionsReferencesINTERLEVEL DIELECTRICS; Geraldine Cogin Schwartz and K.V. SrikrishnanIntroductionInorganic Dielectric FilmsSpin-On Glasses (SOGs)Low Dielectric Constant FilmsBarrier Dielectric Film: a-SiC:HPorous Dielectric FilmsPlasma-Assisted Etching of Organic FilmsReactive Ion Etching of Low-e Interlevel Dielectric FilmsConclusionsReferencesMETALLIZATION; Geraldine Cogin Schwartz and K.V. SrikrishnanIntroductionAluminumAluminum AlloysCopperTungstenPatterning of Aluminum and Aluminum AlloysPatterning of CopperPatterning of TungstenStructure of Metal FilmsChapter SummaryReferencesCHIP INTEGRATION; Geraldine Cogin Schwartz and K.V. SrikrishnanIntroductionTopography, Step Coverage, and PlanarizationSpin-On FilmsStep Coverage by Deposited FilmsIn Situ Planarization/Gap-Fill of Dielectric FilmsEtch-Back ProcessesStep Coverage, Hole-Fill Planarization of MetalsEvaporationSputter Deposition of MetalsDirectional SputteringHigh-Density PlasmasBeam TechniquesFlowage of Metal FilmsCVD MetalsElectrochemical Deposition of CopperEmbedment (Inlaid) ProcessesChemical Mechanical Planarization (CMP)CMP of Inorganic Dielectric FilmsCMP of Low-e FilmsCMP of MetalsPost-CMP CleaningProblems with CMPImpact of CMPConclusions on TopographyRemaining Issues for Chip IntegrationProcess/Structure Choice ConflictsProcessesReliabilityManufacturabilityWafer SizeConcluding Remarks on Compatibility of Materials and ProcessingReferencesRELIABILITY; James R. Lloyd and Kenneth P. RodbellIntroductionThin-Film Interconnect ReliabilityBehavior of Thin-Film Conductors in Stress Voiding and Electromigration TestingElectromigration Behavior of Via ChainsCorrosionInsulator ReliabilityConcluding RemarksReferencesINDEX