Guan, W: Novel Multilayer Structure For Compact Components An Symmetrical Transmission Line Structure for Coupler and Filter
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Fr. 83.90
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
09.12.2008
Verlag
VDMSeitenzahl
140
Maße (L/B/H)
22/15/0.8 cm
Gewicht
227 g
Sprache
Deutsch
ISBN
978-3-639-10975-7
A novel multilayer coupler is proposed in this work.
With the symmetric traces,
the ground plane can be repeated layer by layer. This
innovative design achieves
vertically stacked coupling without vias or
complicated structures. The solution for a set of coupler
specifications is non-unique. The designer has the
freedom to choose a proper
configuration for different applications and
fabrication requirements. The design data
generated by method of moments provides the guideline
for design procedure and tuning.
A prototype 3-dB coupler has been simulated and
fabricated. The numerical
simulation and the experimental measurement show the
same performance as a Lange
coupler with the same frequency requirements. A
prototype stacked bandpass filter has
also been built to demonstrate the design procedure.
This vertical stack filter system can
reduce the circuit footprint size dramatically.
Furthermore, this system is also compatible
with other conventional size reduction methods. The
designer can integrate this
multilayer layer stacked filter design with other
size reduction methods to achieve an
even more compact RF device.
With the symmetric traces,
the ground plane can be repeated layer by layer. This
innovative design achieves
vertically stacked coupling without vias or
complicated structures. The solution for a set of coupler
specifications is non-unique. The designer has the
freedom to choose a proper
configuration for different applications and
fabrication requirements. The design data
generated by method of moments provides the guideline
for design procedure and tuning.
A prototype 3-dB coupler has been simulated and
fabricated. The numerical
simulation and the experimental measurement show the
same performance as a Lange
coupler with the same frequency requirements. A
prototype stacked bandpass filter has
also been built to demonstrate the design procedure.
This vertical stack filter system can
reduce the circuit footprint size dramatically.
Furthermore, this system is also compatible
with other conventional size reduction methods. The
designer can integrate this
multilayer layer stacked filter design with other
size reduction methods to achieve an
even more compact RF device.
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