Copper Interconnect Technology

From the reviews:

“This book addresses the major issues encountered with the use of copper for interconnection lines in microelectronics. It combines materials, technology, and applications to address the needs of the microelectronics researcher. … This book is filled with graphs, data, properties, applications, and methods that will provide both the graduate student in microelectronics and the working microelectronics professional with current information on copper interconnection technology. It is an outstanding reference text that provides an excellent source of information on current copper interconnect technology and future possibilities.” (Electrical Insulation Magazine, Vol. 27 (2), March/April, 2011)