Silicon Devices and Process Integration Deep Submicron and Nano-Scale Technologies
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- Hardcover
- Taschenbuch ausgewählt
- eBook
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Sprache:Englisch
Fr. 150.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
29.10.2010
Verlag
Springer UsSeitenzahl
598
Maße (L/B/H)
23.5/15.5/3.4 cm
Gewicht
931 g
Auflage
Softcover reprint of hardcover 1st edition 2009
Sprache
Englisch
ISBN
978-1-4419-4224-1
Features include:
A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
CMOS-only applications, such as subthreshold current and parasitic latch-up;
Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
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