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Produktbild: CMOS Circuits for Electromagnetic Vibration Transducers
Band 49

CMOS Circuits for Electromagnetic Vibration Transducers Interfaces for Ultra-Low Voltage Energy Harvesting

Aus der Reihe Springer Series in Advanced Microelectronics

Fr. 138.00

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

26.09.2014

Abbildungen

XXIII, 155 illus., schwarz-weiss Illustrationen

Verlag

Springer Netherland

Seitenzahl

300

Maße (L/B/H)

24.1/16/2.4 cm

Gewicht

653 g

Auflage

2015

Sprache

Englisch

ISBN

978-94-017-9271-4

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

26.09.2014

Abbildungen

XXIII, 155 illus., schwarz-weiss Illustrationen

Verlag

Springer Netherland

Seitenzahl

300

Maße (L/B/H)

24.1/16/2.4 cm

Gewicht

653 g

Auflage

2015

Sprache

Englisch

ISBN

978-94-017-9271-4

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: GPSR Kontakt

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Die Leseprobe wird geladen.
  • Produktbild: CMOS Circuits for Electromagnetic Vibration Transducers

  • Foreword; Prof. Eduard Alrcon (UPC BarcelonaTech).

    Preface.

    Part I Application Background and Energy Harvester Interfacing.

    1 Introduction.

    1.1 Motivation - Benefit of a Smart Environment. 1.2 Vision - Usage of Ambient Energy. 1.3 Innovation - Efficient Energy-Aware Operation. 1.4 Contribution of this book. 1.5 Organization of this book. References.

    2 Basic Transducer Interfacing Concepts.

    2.1 Harvesting and Power Processing Chain. 2.2 Interfacing of Vibrational Driven Transducers. 2.3 Dynamic Sliding Load Window MPPT. 2.4 Power Processing Modules. 2.5 Summary on Transducer Interface Requirements. References.

    Part II Circuits and Functional Blocks.

    3 Low-Voltage CMOS Design Fundamentals.

    3.1 Basics on Low-Voltage MOSFET Operation. 3.2 Power-Switch Transistor Design. References.

    4 0.5-V Low-Power Analog Circuits.

    4.1 Low-Voltage Amplifiers. 4.2 Multi-Stage Amplifier without Tail Current Sources. 4.3 0.5V Line Regulation. 4.4 Biasing and Voltage Reference. 4.5 Comparators. 4.6 Timing Control. References.

    Part III Prototype Development and Circuit Integration.

    5 Low-Voltage Rectification of High-resistive Sources.

    5.1 Review on Low-Voltage Rectification. 5.2 Test and Measurement Setup. 5.3 Active Rectification of High-Impedance Sources. 5.4 Active Voltage Doubler Rectifier. References.

    6 Input Load Adapting Charge Pump Interface. 6.1 Charge Pump Review. 6.2 Generic Implementation Concept and Operation. 6.3 MPPT Charge Pump Parameter Optimization. 6.4 Integrated Circuit Implementation of the Prototype. 6.5 ILACP Chip Characterization. References.

    7 Load Matching Detector.

    7.1 Motivation and Review. 7.2 Test Setup and Characterization. 7.3 Method of Detection. 7.4 Circuit Implementation. 7.5 Simulation Results and Usage. References.

    8 Switched-Inductor Capacitive Interface.

    8.1 Review and Requirements. 8.2 Basic Interface Concept. 8.3 Performance Preview using SPICE Simulation. 8.4 PCB Implementation, Experiments and Results. 8.5 Conclusion and Outlook. References.

    9 Conclusion and Future Aspects.

    9.1 Summary of Achievements. 9.2 Open Problems. 9.3 Suggestions for Future Work. References.

    A Application Load Profile.

    B Electromagnetic Transducer - Model and Properties.

    B.1 Lumped Transducer Models. B.2 Parameter Equations and Relations. B.3 Load Effects at Averaged Harvesting.

    C MPP Tracking - Power Transfer Timing.

    D MOS Devices and XH035 Process.

    D.1 Performance Limitation. D.1.1 Noise and Mismatch. D.1.2 Frequency and Bandwidth Limitation. D.2 XH035 Process Parameters. D.3 Power-Switch Design Tables. References.

    E Circuit Blocks Implementation Tables.

    E.1 Amplifier. E.2 Bias and References. E.3 Comparators. E.4 Timing. E.5 Digital Cell Drive Losses.

    F AC-DC Rectification.

    G Load Matching Detector.

    G.1 Proposed Load Matching Detection.

    H Switched Inductor Capacitive Interface.

    H.1 Maximum Tracking Speed. H.2 Converter Parameter Study. H.3 PCB Implementation Details.

    I Source Code Listings and Models.

    I.1 VerilogA Listing. I.2 PSPICE - SICI Simulation. I.3 dsPIC Programming.

    Index.