Beschreibung
Produktdetails
Einband
Gebundene Ausgabe
Erscheinungsdatum
01.08.2023
Verlag
Mdpi AgSeitenzahl
382
Maße (L/B/H)
25/17.5/2.9 cm
Gewicht
1154 g
Sprache
Englisch
ISBN
978-3-0365-8299-3
This Special Issue serves as a valuable resource for readers seeking to delve into the exciting field of flexible and wearable electronics and contribute to their further advancements. This Special Issue presents research papers, short communications, and review articles focusing on the following themes: (1) Novel structural designs, material fabrication, signal processing, and modeling of flexible and wearable sensors applying a wide range of mechanisms to flexible and wearable electronics; (2) MEMS techniques used in the production process of wearable and flexible sensors, along with simulation analysis with theoretical modeling; (3) Multiple application scenarios utilizing multivariable flexible and wearable sensor systems.
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