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  • Produktbild: 6th International Conference on Signal Processing and Information Communications
  • Produktbild: 6th International Conference on Signal Processing and Information Communications

6th International Conference on Signal Processing and Information Communications ICSPIC 2023

Fr. 264.00

inkl. gesetzl. MwSt., Versandkostenfrei


Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

11.11.2023

Herausgeber

Chua-Chin Wang + weitere

Verlag

Springer

Seitenzahl

116

Maße (L/B/H)

24.1/16/1.3 cm

Gewicht

366 g

Sprache

Englisch

ISBN

978-3-031-43780-9

Beschreibung

Portrait

Dr. Chua-Chin Wang received the Ph.D. degree in electrical engineering from SUNY (State University of New York) at Stony Brook, USA, in 1992. He then joined Department of Electrical Engineering, National Sun Yat-Sen University (NSYSU), Taiwan. He was Chairman of this department during 2009 - 2012. He was CEO of Operation Center of Industry-University Cooperation, NSYSU, in 2012-2014. He was appointed to be VP of Office of Industrial Collaboration and Continuing Education Affairs, from 2014 to 2015. He was elected as Dean of Engineering College during 2014-2017. He became as Director Generalof Underwater Vehicle R&D Center since 2018. He is now Vice President, Office of Research and Development, NSYSU. Dr. Wang’s research interests include memory and logic circuit design, communication circuit design, bio-medical circuits, and particularly interfacing I/O circuits. He also won Distinguished Electrical Engineering Professor Award of Chinese Institute of Electrical Engineers in 2007. In 2010, he was honored to be Distinguished Professor of National Sun Yat-Sen University. In 2012, he won “Distinguished Engineering Professor” Award of Chinese Institute of Engineers and Outstanding Research Award of NSYSU. He became IET Fellow in 2012. He was named as ASE Chair Professor in 2013 for the recognition of his achievement in the area of VLSI design and contribution to industry technology development. He won Outstanding Technical Achievement Award of IEEE Tainan Section in 2018. Prof. Wang has devoted himself for many IEEE services. He was Tainan Chapter Chair of IEEE Circuits and Systems Society (CASS) in 2007-2008. He was also the founding Tainan Chair of IEEE Solid-State Circuits Society (SSCS) for 2007-2008, and the founding Consultant of IEEE NSYSU Student Branch. He was elected to be Vice Chair of IEEE Tainan Section in 2012. He was elected to be Chair of IEEE CASS Nanoelectronics and Giga-scale Systems (NG) Technical Committee to serve during 2008-2009. He has been invited to be Associate Editors of IEEE Trans. on TCAS-I (2010-2013) and TCAS-II (2010-2011). He was General Chair of 2012 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), which is the flagship conference of IEEE CASS Region 10.

 

Dr. Arumugam Nallanathan is Professor of Wireless Communications and the founding head of the Communication Systems Research (CSR) group in the School of Electronic Engineering and Computer Science at Queen Mary University of London since September 2017. He was with the Department of Informatics at King’s College London from December 2007 to August 2017, where he was Professor of Wireless Communications from April 2013 to August 2017. He was an Assistant Professor in the Department of Electrical and Computer Engineering, National University of Singapore from August 2000 to December 2007. His research interests include 6G Wireless Networks, Internet of Things (IoT) and Molecular Communications. He published more than 500 technical papers in scientific journals and international conferences. He is a co-recipient of the Best Paper Awards presented at the IEEE International Conference on Communications 2016 (ICC’2016), IEEE Global Communications Conference 2017 (GLOBECOM’2017) and IEEE Vehicular Technology Conference 2017 (VTC’2017). He is an Editor-at-Large for IEEE Transactions on Communications and a senior editor for IEEE Wireless Communications Letters. He was an Editor for IEEE Transactions on Wireless Communications (2006-2011), IEEE Transactions on Vehicular Technology (2006-2017), IEEE Signal Processing Letters and a Guest Editor for IEEE Journal on Selected Areas in Communications (JSAC). He served as the Chair for the Signal Processing and Computing for Communications (SPCC-TC) of IEEE Communications Society and Technical Program Chair and member of Technical Program Committees in numerous IEEE conferences. He received the IEEE Communications Society SPCE outstanding service award 2012 and IEEE Communications Society RCC outstanding service award 2014. He has been selected as a Web of Science (ISI) Highly Cited Researcher in 2016. He is an IEEE Fellow and IEEE Distinguished Lecturer.



Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

11.11.2023

Herausgeber

Verlag

Springer

Seitenzahl

116

Maße (L/B/H)

24.1/16/1.3 cm

Gewicht

366 g

Sprache

Englisch

ISBN

978-3-031-43780-9

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

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  • Produktbild: 6th International Conference on Signal Processing and Information Communications
  • Produktbild: 6th International Conference on Signal Processing and Information Communications
  • Introduction.- Adaptive Filtering & Signal Processing, Ad-Hoc and Sensor Networks.- Analog and Mixed Signal Processing.- Array Signal Processing.- Audio and Electroacoustics.- Audio/Speech Processing and Coding.- Bioimaging and Signal Processing.- Biometrics & Authentification.- Biosignal Processing & Understanding.- Communication and Broadband Networks.- Computer Vision & Virtual Reality.- Cryptography and Network Security.- Design and Implementation of Signal Processing Systems.- Compressive sensing.- machine learning methods for communications and signal processing.- Conclusion.