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  • Produktbild: Handbook of Materials and Techniques for Vacuum Devices
  • Produktbild: Handbook of Materials and Techniques for Vacuum Devices

Handbook of Materials and Techniques for Vacuum Devices

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Beschreibung

Market: Engineers, researchers, and students in vacuum science and materials science and designers and manufacturers of vacuum electronic devices in any field where glass, ceramics, refractory metals, and joining methods are used. The republication of this widely used handbook makes available again an...

Beschreibung

Market: Engineers, researchers, and students in vacuum science and materials science and designers and manufacturers of vacuum electronic devices in any field where glass, ceramics, refractory metals, and joining methods are used. The republication of this widely used handbook makes available again an invaluable source of fundamental information on the construction of vacuum devices and provides a complete rundown on the properties of basic materials used in vacuum tubes (glass, ceramics, mica, carbon, graphite, iron, steel, copper, nickel, precious metals, refractory metals, and all relevant alloys). Most importantly, it offers step-by- step guidelines for basic joining techniques, including how to deal with common problems such as secondary emission and voltage breakdown. High-temperature properties are emphasized in recognition of the crucial role of vacuum devices in space technology.

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

08.05.1997

Abbildungen

XIII, 623 p.

Verlag AIP Press

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

08.05.1997

Abbildungen

XIII, 623 p.

Verlag AIP Press
Seitenzahl

623

Maße (L/B/H)

23.5/19.1/3.5 cm

Gewicht

2420 g

Auflage

1995

Sprache

Englisch

ISBN

978-1-56396-387-2

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Handbook of Materials and Techniques for Vacuum Devices
  • Produktbild: Handbook of Materials and Techniques for Vacuum Devices
  • Contents: 1. Glass. 2. Ceramics. 3. Mica. 4. Carbon and Graphite. 5. Iron and Steel. 6. Copper and Copper Alloys. 7. Nickel and Nickel Alloys. 8. Precious Metals and Their Alloys. Introduction to Refractory Metals (RM). 9. Tungsten and Tungsten Alloys. 10. Molybdenum and Molybdenum Alloys. 11. Tantalum and Columbium (Niobium) and their Alloys. 12. Titanium, Zirconium, and Hafnium and their alloys. Introduction to Joining Processes. 13. Soldering and Brazing. 14. Glass-to-Metal Sealing. 15. Ceramic-to-Metal Sealing. 16. Cathodes and Heaters. 17. Grid Structures and Coatings. 18. Getter Materials. 19. Secondary Emission. 20. Voltage Breakdown.