Guidebook for Managing Silicon Chip Reliability
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- Hardcover ausgewählt
- Taschenbuch
- eBook
-
Sprache:Englisch
Fr. 208.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Gebundene Ausgabe
Erscheinungsdatum
29.12.1998
Verlag
Taylor and FrancisSeitenzahl
226
Maße (L/B/H)
24/16.1/1.7 cm
Gewicht
508 g
Sprache
Englisch
ISBN
978-0-8493-9624-3
This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. * Concentrates on device failure and causes throughout the text - showing how to model the mechanism, test for defects, and avoid and manage damange. * Presents information on evolving IC technologies. TOC:Introduction.- How Devices Fail.- Intrinsic Device Sensitivities.- Electromigration.- Hot Carrier Aging.- Time Dependent Dielectric Breakdown. Mechanical Stress Induced Migration.- Alpha Particle Sensitivity.- Electrostatic Discharge and Electrical Overstress. Latch-Up. Qualification. Screening. Design for Reliability. Summary.
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