Produktbild: Nano and Micromachining

Nano and Micromachining

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Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

01.06.2009

Herausgeber

J. Paulo Davim + weitere

Verlag

John Wiley & Sons Inc

Seitenzahl

212

Maße (L/B/H)

23.6/16/1.8 cm

Gewicht

454 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-1-84821-103-2

Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

01.06.2009

Herausgeber

Verlag

John Wiley & Sons Inc

Seitenzahl

212

Maße (L/B/H)

23.6/16/1.8 cm

Gewicht

454 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-1-84821-103-2

Herstelleradresse

Libri GmbH
Europaallee 1
36244 Bad Hersfeld
DE

Email: gpsr@libri.de

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  • Produktbild: Nano and Micromachining
  • Preface ix

    Chapter 1. Nanoscale Cutting 1
    Rüdiger RENTSCH

    1.1. Introduction 1

    1.2. Basic elements of molecular dynamics modeling 3

    1.2.1. Material representation and microstructure 3

    1.2.2. Atomic interaction 4

    1.2.3. System dynamics and numerical description 7

    1.2.4. Boundary conditions 8

    1.3. Design and requirements for state-of-the-art MD cutting process simulations 10

    1.4. Capabilities of MD for nanoscale material removal process analysis 12

    1.4.1. Analysis of microstructure and deformation 12

    1.4.2. Obtaining cutting forces, stress and temperature 15

    1.5. Advances and recent developments in material removal process simulation 18

    1.5.1. Complete 3D surface machining simulation 18

    1.5.2. Consideration of fluids in MD cutting simulation 20

    1.6. Summary and outlook 23

    1.7. References 24

    Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces 27
    Xiaoping LI

    2.1. Introduction 27

    2.2. The mechanism of ductile mode cutting of brittle materials 29

    2.2.1. Transition of chip formation mode from ductile to brittle 29

    2.2.2. MD modeling and simulation of nanoscale ductile mode cutting of silicon 32

    2.2.3. The mechanism of ductile mode chip formation in cutting of silicon 32

    2.3. The chip formation in cutting of brittle materials 35

    2.3.1. Material deformation and crack initiation in the chip formation zone 35

    2.3.2. Stress conditions in the chip formation zone in relation to ductile-brittle mode of chip formation 36

    2.4. Machined surfaces in relation to chip formation mode 38

    2.5. References 40

    Chapter 3. Diamond Tools in Micromachining 45
    Waqar AHMED, Mark J. JACKSON and Michael D. WHITFIELD

    3.1. Introduction 45

    3.2. Diamond technology 45

    3.2.1. Hot Filament CVD (HFCVD) 46

    3.3. Preparation of substrate 48

    3.3.1. Selection of substrate material 48

    3.3.2. Pre-treatment of substrate 49

    3.4. Modified HFCVD process 51

    3.4.1. Modification of filament assembly 51

    3.4.2. Process conditions 52

    3.5. Nucleation and diamond growth 53

    3.5.1. Nucleation 54

    3.5.2. Bias-enhanced nucleation (BEN) 55

    3.5.3. Influence of temperature 56

    3.6. Deposition on complex substrates 58

    3.6.1. Diamond deposition on metallic (molybdenum) wire 58

    3.6.2. Deposition on WC-Co microtools 58

    3.6.3. Diamond deposition on tungsten carbide (WC-Co) microtool 59

    3.7. Diamond micromachining 62

    3.7.1. Performance of diamond-coated microtool 66

    3.8. Conclusions 67

    3.9. References 67

    Chapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling 71
    Wit GRZESIK

    4.1. Introduction 71

    4.1.1. Definitions and technological possibilities 71

    4.1.2. Main applications of micromachining 72

    4.2. Microturning 74

    4.2.1. Characteristic features and applications 74

    4.2.2. Microturning tools and tooling systems 75

    4.2.3. Machine tools for microturning 77

    4.3. Microdrilling 79

    4.3.1. Characteristic features and applications 79

    4.3.2. Microdrills and tooling systems 80

    4.3.3. Machine tools for microdrilling 83

    4.4. Micromilling 85

    4.4.1. Characteristic features and applications 85

    4.4.2. Micromills and tooling systems 87

    4.4.3. Machine tools for micromilling 89

    4.5. Product quality in micromachining 92

    4.5.1. Quality challenges in micromachining 92

    4.5.2. Burr formation in micromachining operations 92

    4.5.3. Surface quality inspection of micromachining products 96

    4.6. References 98

    Chapter 5. Microgrinding and Ultra-precision Processes 101
    Mark J. JACKSON and Michael D. WHITFIELD

    5.1. Introduction 101

    5.2. Micro and nanogrinding 104

    5.2.1. Nanogrinding apparatus. 105

    5.2.2. Nanogrinding procedures 105

    5.3. Nanogrinding tools 106

    5.3.1. Dissolution modeling 109

    5.3.2. Preparation of nanogrinding wheels 110

    5.3.3. Bonding systems 112

    5.3.4. Vitrified bonding systems 113

    5.4. Conclusions 121