Failure of Electronic Packaging: Effects of Temperature, Moisture, Mechanical, and Electrical Driving Forces Effects of Temperature, Moisture, Mechanical, Electrical Driving
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- Englisch ausgewählt
Fr. 299.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Gebundene Ausgabe
Erscheinungsdatum
Juni 2010
Herausgeber
Y. W. Mai + weitereVerlag
CRC PressSeitenzahl
200
Sprache
Englisch
ISBN
978-1-4398-0209-0
The reliability of components is a prime concern to electronics manufacturers and the failure of microelectronic packaging is a major source of component faults. Failure of Electronic Packaging: Effects of Temperature, Moisture, Mechanical and Electrical Driving Forces provides a thorough review of this important field of research. This practical guide discusses theoretical aspects, experimental results, modeling techniques, and results. The authors have used their extensive experience to produce detailed chapters covering temperature, moisture, mechanical shock, and electrical induced failure in addition to adhesive interconnects and viscoelasticity. Useful program files and macros are included.
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