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  • Produktbild: Failure Analysis of Integrated Circuits
  • Produktbild: Failure Analysis of Integrated Circuits
Band 494

Failure Analysis of Integrated Circuits Tools and Techniques

Aus der Reihe Springer International Series in Engineering and Computer

Fr. 191.00

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.11.2012

Abbildungen

XIII, 255 p.

Herausgeber

Lawrence C. Wagner

Verlag

Springer Us

Seitenzahl

255

Maße (L/B/H)

23.5/15.5/1.5 cm

Gewicht

417 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-1-4613-7231-8

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

09.11.2012

Abbildungen

XIII, 255 p.

Herausgeber

Lawrence C. Wagner

Verlag

Springer Us

Seitenzahl

255

Maße (L/B/H)

23.5/15.5/1.5 cm

Gewicht

417 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-1-4613-7231-8

Herstelleradresse

Springer-Verlag KG
Sachsenplatz 4-6
1201 Wien
AT

Email: ProductSafety@springernature.com

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  • Produktbild: Failure Analysis of Integrated Circuits
  • Produktbild: Failure Analysis of Integrated Circuits
  • 1 Introduction.- 1.1 Electrical Characterization.- 1.2 Die Exposure.- 1.3 Fail Site Isolation.- 1.4 Package Analysis.- 1.5 Physical and Chemical Analysis.- 1.6 Diagnostic Activities.- 1.7 Root Cause and Corrective Action.- 1.8 Conclusion.- 2 Electrical Characterization.- 2.1 Electrical Characterization.- 2.2 Curve Tracing.- 2.3 Electrical Characterization of State Dependent Logic Failures.- 2.4 Memory Functional Failures.- 2.5 Challenges of Analog Circuit Fault Isolation and Analog Building Blocks.- 2.6 Future Challenges for Circuit Characterization.- 3 Package Analysis: SAM and X-ray.- 3.1 The Scanning Acoustic Microscope.- 3.2 The Real-Time X-Ray Inspection System.- 3.3 Application Examples.- 3.4 Summary and Trends in Nondestructive Inspection.- 4 Die Exposure.- 4.1 Didding Cavity Packages.- 4.2 Decapsulation of Plastic Packages.- 4.3 Alternative Decapsulation Methods.- 4.4 Backside Preparation for Characterization and Analysis.- 4.5 Future Requirements.- 5 Global Failure Site Isolation: Thermal Techniques.- 5.1 Blackbody Radiation and Infrared Thermography.- 5.2 Liquid Crystals.- 5.3 Fluorescent Microthermal Imaging.- 5.4 Conclusion.- 6 Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques.- 6.1 Photon Emission Microscopy.- 6.2 Active Photon Probing.- 6.3 Active Electron Beam Probing.- 6.4 Future Developments for Photon and Electron Based Failure Analysis.- 7 Probing Technology for IC Diagnosis.- 7.1 Probing Applications and Key Probing Technologies.- 7.2 Mechanical Probing.- 7.3 E-beam Probing.- 7.4 Navigation and Stage Requirements.- 7.5 FIB for Probing and Prototype Repair.- 7.6 Backside Probing for Flip Chip IC.- 8 Deprocessing.- 8.1 IC Wafer Fabrication.- 8.2 Deprocessing Methods.- 8.3 New Challenges.- 9 Cross-section Analysis.- 9.1Packaged Device Sectioning Techniques.- 9.2 Wafer Cleaving.- 9.3 Die Polishing Techniques.- 9.4 Cross Section Decoration: Staining.- 9.5 Focused Ion Beam (FIB) Techniques.- 9.6 Sectioning Techniques for TEM Imaging.- 9.7 Future Issues.- 10 Inspection Techniques.- 10.1 Microscopy.- 10.2 Optical Microscopy.- 10.3 Scanning Electron Microscopy.- 10.4 Focused Ion Beam Imaging.- 10.5 Transmission Electron Microscopy.- 10.6 Scanning Probe Microscopy.- 10.7 Future Considerations.- 11 Chemical Analysis.- 11.1 Incident Radiation Sources.- 11.2 Radiation-Sample Interaction.- 11.3 Radiation Flux.- 11.4 Detectors.- 11.5 Common Analysis Techniques.- 11.6 Microspot FTIR.- 11.7 Other Techniques.- 11.8 Conclusion.- 12 Energy Dispersive Spectroscopy.- 12.1 Characteristic X-Ray Process and Detection.- 12.2 Quantitative Analysis.- 12.3 Sample Considerations.- 12.4 EDS Applications.- 12.5 Future Considerations.- 13 Auger Electron Spectroscopy.- 13.1 The Auger Electron Process.- 13.2 AES Instrumentation and Characteristics.- 13.3 AES Data Collection and Analysis.- 13.4 Specimen, Material, and AES Operational Concerns.- 13.5 AES in Failure Analysis.- 13.6 Conclusion.- 14 Secondary Ion Mass Spectrometry, SIMS.- 14.1 Basic SIMS Theory and Instrumentation.- 14.2 Operational Modes, Artifacts, and Quanitification.- 14.3 Magnetic Sector SIMS Applications.- 14.4 Quadrupole SIMS Applications.- 14.5 Time-of-Flight SIMS Applications.- 14.6 Future SIMS Issues.- 15 Failure Analysis Future Requirements.- 15.1 IC Technology Trends Driving Failure Analysis.- 15.2 Global Failure Site Isolation.- 15.3 Development in Probing.- 15.4 Deprocessing Difficulties.- 15.5 Defect Inspection - A Time vs. Resolution Tradeoff.- 15.6 Failure Analysis Alternatives.- 15.7 Beyond the Roadmap.