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Produktbild: Microtransducer CAD

Microtransducer CAD Physical and Computational Aspects

Aus der Reihe Computational Microelectronics

Fr. 72.90

inkl. gesetzl. MwSt., Versandkostenfrei

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

03.10.2013

Abbildungen

XVIII, 427 p. 44 illus.

Verlag

Springer Wien

Seitenzahl

427

Maße (L/B/H)

23.5/15.5/2.5 cm

Gewicht

686 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-3-7091-7321-3

Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

03.10.2013

Abbildungen

XVIII, 427 p. 44 illus.

Verlag

Springer Wien

Seitenzahl

427

Maße (L/B/H)

23.5/15.5/2.5 cm

Gewicht

686 g

Auflage

Softcover reprint of the original 1st ed. 1999

Sprache

Englisch

ISBN

978-3-7091-7321-3

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Microtransducer CAD
  • 1. Introduction.- 1.1 Modeling and Simulation of Microtransducers.- 1.2 Illustrative Example.- 1.3 Progress in Microtransducer Modeling.- 1.4 References.- 2 Basic Electronic Transport.- 2.1 Poisson’s Equation.- 2.2 Continuity Equations.- 2.3 Carrier Transport in Crystalline Materials and Isothermal Behavior.- 2.4 Electrical Conductivity and Isothermal Behavior in Polycrystalline Materials.- 2.5 Electrical Conductivity and Isothermal Behavior in Metals.- 2.6 Boundary and Interface Conditions.- 2.7 The External Fields — What Do They Influence?.- 2.8 References.- 3 Radiation Effects on Carrier Transport.- 3.1 Reflection and Transmission of Optical Signals.- 3.2 Modeling Optical Absorption in Intrinsic Semiconductors.- 3.3 Absorption in Heavily-Doped Semiconductors.- 3.4 Optical Generation Rate and Quantum Efficiency.- 3.5 Low Energy Interactions with Insulators and Metals.- 3.6 High Energy Interactions and Monte Carlo Simulations.- 3.7 Model Equations for Radiant Sensor Simulation.- 3.8 Illustrative Simulation Example — Color Sensor.- 3.9 References.- 4 Magnetic Field Effects on Carrier Transport.- 4.1 Galvanomagnetic Transport Equation.- 4.2 Galvanomagnetic Transport Coefficients.- 4.3 Equations and Boundary Conditions for Magnetic Sensor Simulation.- 4.4 Illustrative Simulation Example — Micromachined Magnetic Vector Probe.- 4.5 References.- 5 Thermal Non-Uniformity Effects on Carrier Transport.- 5.1 Non-Isothermal Effects.- 5.2 Electrothermal Transport Model.- 5.3 Electrical and Thermal Transport Coefficients.- 5.4 Electro-Thermo-Magnetic Interactions.- 5.5 Heat Transfer in Thermal Microstructures.- 5.6 Summary of Equations and Computational Procedure.- 5.7 Illustrative Simulation Example — Micro Pirani Gauge.- 5.8 References.- 6 Mechanical Effects on CarrierTransport.- 6.1 Piezoresistive Effect.- 6.2 Strain and Electron Transport.- 6.3 Strain and Hole Transport.- 6.4 Piezojunction Effect.- 6.5 Effects of Stress Gradients.- 6.6 Galvano-Piezo-Magnetic Effects.- 6.7 The Piezo Drift-Diffusion Transport Model.- 6.8 Illustrative Simulation Example — Stress Effects on Hall Sensors.- 6.9 References.- 7 Mechanical and Fluidic Signals.- 7.1 Definitions.- 7.2 Model Equations for Mechanical Analysis.- 7.3 Model Equations for Analysis of Fluid Transport.- 7.4 Illustrative Simulation Example — Analysis of Flow Channels.- 7.5 References.- 8 Micro-Actuation.- 8.1 Transduction Principles.- 8.2 State-of-the-Art and Preview.- 8.3 Electrostatic Actuation.- 8.4 Thermal Actuation.- 8.5 Magnetic Actuation.- 8.6 Piezoelectric Actuation.- 8.7 Electroacoustic Transducers.- 8.8 Computational Procedure and Coupling.- 8.9 Illustrative Example — CMOS Micromirror.- 8.10 References.- 9 Microsystem Simulation.- 9.1 Electrical Analogues for Mixed-Signals and Historical Developments.- 9.2 Circuit Modeling and Implementation Considerations.- 9.3 Lumped Analysis: Illustrative Example — Electrostatic Micromirror.- 9.4 Distributed Analysis: Illustrative Example — Flow Microsensor.- 9.5 References.