Carbon Nanotube Based VLSI Interconnects Analysis and Design
Aus der Reihe
SpringerBriefs in Applied Sciences and Technology
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Sprache:Englisch
Fr. 73.90
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
11.11.2014
Abbildungen
XI, 86 p. 57 illus.
Verlag
Springer IndiaSeitenzahl
86
Maße (L/B/H)
23.5/15.5/0.6 cm
Gewicht
166 g
Auflage
2015
Sprache
Englisch
ISBN
978-81-322-2046-6
The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
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