Advances in 3d Integrated Circuits and Systems
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- Hardcover ausgewählt
- Taschenbuch
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Sprache:Englisch
Fr. 174.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Gebundene Ausgabe
Erscheinungsdatum
28.08.2015
Verlag
World Scientific PublishingSeitenzahl
392
Maße (L/B/H)
23.5/15.7/2.6 cm
Gewicht
717 g
Sprache
Englisch
ISBN
978-981-4699-00-6
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory. Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
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