Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
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- Hardcover
- Taschenbuch ausgewählt
- eBook
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Sprache:Englisch
Fr. 127.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
19.12.2018
Abbildungen
X, 155 illus., 152 illus. in color., schwarz-weiss Illustrationen, farbige Illustrationen
Verlag
SpringerSeitenzahl
177
Maße (L/B/H)
23.5/15.5/1.1 cm
Gewicht
295 g
Auflage
Softcover reprint of the original 1st ed. 2018
Sprache
Englisch
ISBN
978-3-030-09323-5
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
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