Produktbild: Advances in Communication, Devices and Networking
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Advances in Communication, Devices and Networking Proceedings of ICCDN 2021

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Beschreibung

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

01.09.2023

Herausgeber

Sourav Dhar + weitere

Verlag

Springer Singapore

Seitenzahl

649

Maße (L/B/H)

23.5/15.5/3.4 cm

Auflage

1st ed. 2023

Sprache

Englisch

ISBN

978-981-19-2006-6

Beschreibung

Portrait

Dr. Sourav Dhar (Senior Member, IEEE)  is currently Professor and Head of the ECE Department, SMIT. His current research interests include IoT, WSN, remote sensing and microwave filter design. He is Member of IEEE, the IEEE-GRSS society and IEI, India. He has published more than 30 papers in SCI/Scopus indexed international journals and at conferences. He also serves as Reviewer for Wireless Personal Communication, IEEE Transactions on Vehicular Technology and several other journals and conferences.  

Dr. Dinh-Thuan Do (Senior Member, IEEE) received the B.S., M. Eng. and Ph.D. degrees from Vietnam National University (VNU-HCMC), in 2003, 2007 and 2013, respectively, all in Communications Engineering. He was Visiting Ph.D. student with the Communications Engineering Institute, National Tsing Hua University, Taiwan, from 2009 to 2010. Prior to joining Ton Duc Thang University, he was Senior Engineer with VinaPhone Mobile Network, from 2003 to 2009. He was a founder of Wireless Communications Research Group funded by Ton Duc Thang University during period from 2016 to 2020. He was a supervisor for numerous Ph.D. students in the Ph.D. joint program managed by Ton Duc Thang University and Technical University of Ostrava (VSB), Czech Republic. He was a recipient of Golden Globe Award from Vietnam Ministry of Science and Technology in 2015 (Top 10 most excellent scientist nationwide). He currently works as Assistant Professor in the Department of Computer Science and Information Engineering, Asia University (Taiwan). His publications include 1 textbook, 7 book chapters, over 95 SCIE-indexed journal articles, over 100 other journal articles and international conference papers. According Stanford's list, he was recognized as a scholar of top 2% scientists in the world (2020). He is currently serving as Editor of Computer Communications (Elsevier), Associate Editor of EURASIP Journal on Wireless Communications and Networking (Springer),  Associate Editor of Electronics and an Editor of KSII Transactions on Internet and Information Systems. 

Dr. Samarendra Nath Sur (Senior Member, IEEE) is Assistant Professor (SG) at the ECE Department, Sikkim Manipal Institute of Technology, India. His current research interests include broadband wireless communication, advanced digital signal processing and remote sensing. He is the recipient of the University Medal & Dr. S.C. Mukherjee Memorial Gold Centered Silver Medal from Jadavpur University in 2007. He is a member of IEEE, IEEE-IoT, IEEE-SPS, IEI, India, and IAENG. He has published more than 55 papers in SCI/Scopus indexed international journals and at conferences. He also serves as a reviewer for the International Journal of Electronics, IET Communication, Ad Hoc Networks and IEEE Transactions on Signal Processing. He is currently editing several books with Springer Nature, Elsevier, and Routledge & CRC Press. He is also serving as Guest Editor for special issues of the journal like Springer Nature and Hindawi.

  Dr. Chuan-Ming Liu is Professor in the Department of CSIE, National Taipei University of Technology, Taiwan, where he was the Department Chair from 2013 to 2017. Currently, he is Head of the Extension Education Center at the same school. He has published more than 80 papers in various prestigious journals and at international conferences. His current research interests include big data management and processing, uncertain data management, data science, spatial data processing, data streams, ad hoc and sensor networks and location-based services.

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

01.09.2023

Herausgeber

Verlag

Springer Singapore

Seitenzahl

649

Maße (L/B/H)

23.5/15.5/3.4 cm

Auflage

1st ed. 2023

Sprache

Englisch

ISBN

978-981-19-2006-6

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

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