Band 661
VLSI-SoC: Technology Advancement on SoC Design 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4–8, 2021, Revised and Extended Selected Papers
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- Hardcover
- Taschenbuch ausgewählt
- eBook
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Sprache:Englisch
Fr. 72.90
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
02.10.2023
Abbildungen
XIV, 267 p. 143 illus., 109 illus. in color.
Herausgeber
Victor Grimblatt + weitereVerlag
SpringerSeitenzahl
267
Maße (L/B/H)
23.5/15.5/1.6 cm
Gewicht
435 g
Auflage
1st edition 2022
Sprache
Englisch
ISBN
978-3-031-16820-8
This book contains extended and revised versions of the best papers presented at the 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, held in Singapore, in October 2021*.
The 12 full papers included in this volume were carefully reviewed and selected from the 44 papers (out of 75 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.
*The conference was held virtually.
The 12 full papers included in this volume were carefully reviewed and selected from the 44 papers (out of 75 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.
*The conference was held virtually.
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