Thermal design, simulation, and sensing of electronic products DE
-
- Englisch ausgewählt
Fr. 126.00
inkl. gesetzl. MwSt.,
Beschreibung
Produktdetails
Einband
Taschenbuch
Erscheinungsdatum
12.11.2024
Verlag
LAP LAMBERT Academic PublishingSeitenzahl
312
Maße (L/B/H)
22/15/2 cm
Gewicht
483 g
Sprache
Englisch
ISBN
978-3-659-81222-4
Thermal design refers to the process of fully cooling electronic equipment through relevant technical means to meet the requirements of reliability and service life. Thermal design should be carried out at the same time as electrical design, structural design, and reliability design, and when there is a contradiction, a trade-off analysis should be carried out and a compromise should be solved. Engaged in thermal design work, you should master the basic knowledge of heat, fluid mechanics, etc., and put forward a reasonable thermal design scheme based on practical work experience. The heat dissipated by the device determines the temperature rise and, therefore, the temperature of any given structure; Heat is transferred by thermal conduction, convection, and radiation, and the heat transferred in each form is inversely proportional to its thermal resistance; Heat, thermal resistance, and temperature are important parameters in thermal design; All cooling systems should be the simplest and most economical, suitable for specific electrical and mechanical, and environmental conditions, while meeting reliability requirements.
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