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Produktbild: Sustained Simulation Performance 2022

Sustained Simulation Performance 2022 Proceedings of the Joint Workshop on Sustained Simulation Performance, High-Performance Computing Center Stuttgart (HLRS), University of Stuttgart and Tohoku University, May and October 2022

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Beschreibung

This book presents the state of the art in High-Performance Computing on modern supercomputer architectures. It addresses trends in hardware and software development in general. The contributions cover a broad range of topics, from performance evaluations in context with power efficiency to Computational...

Beschreibung

This book presents the state of the art in High-Performance Computing on modern supercomputer architectures. It addresses trends in hardware and software development in general. The contributions cover a broad range of topics, from performance evaluations in context with power efficiency to Computational Fluid Dynamics and High-Performance Data Analytics. In addition, they explore new topics like the use of High-Performance Computers in the field of Artificial Intelligence and Machine Learning. All contributions are based on selected papers presented in 2022 at the 33rd Workshop on Sustained Simulation Performance, WSSP33, held at HLRS in Stuttgart, Germany, and WSSP34, held at Tohoku University in Sendai, Japan.


Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

15.03.2025

Abbildungen

VII, 81 p. 43 illus., 25 illus. in color.

Herausgeber Michael M. Resch + weitere

Produktdetails

Einband

Taschenbuch

Erscheinungsdatum

15.03.2025

Abbildungen

VII, 81 p. 43 illus., 25 illus. in color.

Herausgeber
Verlag Springer
Seitenzahl

81

Maße (L/B/H)

23.5/15.5/0.6 cm

Gewicht

171 g

Sprache

Englisch

ISBN

978-3-031-41075-8

Herstelleradresse

Springer-Verlag GmbH
Tiergartenstr. 17
69121 Heidelberg
DE

Email: ProductSafety@springernature.com

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  • Produktbild: Sustained Simulation Performance 2022

  • Performance and Power.- Numeric and Optimization.- Data Handling and New Concepts.- Trends in HPC and AI.